Superior Fanless Embedded System with LGA 1200 for Intel 10th Gen CPU & Q470E PCH
| System | |
|---|---|
| Processor | Support 10th Gen Intel® CML S Processor (LGA 1200, 35W TDP) - Intel® Core™ i9-10900TE, 10 Cores, 20MB Cache, up to 4.5 GHz, TDP 35W - Intel® Core™ i7-10700TE, 8 Cores, 16MB cache, up to 4.4 GHz, TDP 35W - Intel® Core™ i5-10500TE, 6 Core, 12MB Cache, up to 3.7 GHz, TDP 35W - Intel® Core™ i3-10100TE, 4 Cores, 9MB Cache, up to 3.6 GHz, TDP 35W - Intel® Pentium® G6400TE, 2 Cores, 4MB Cache, 3.2 GHz, TDP 35W - Intel® Celeron® G5900TE, 2 Cores, 2MB Cache, 3.0 GHz, TDP 35W |
| System Chipset | Intel® Q470E Express Chipset |
| LAN Chipset | GbE1: Intel I219 (Support Wake-on-LAN and PXE) 2.5 GbE2: Intel I225 (Support Wake-on-LAN and PXE) |
| Audio Codec | Realtek ALC888S |
| System Memory | 2x 260-Pin DDR4 2666/2933MHz SODIMM. Max. up to 64GB |
| BIOS | AMI 256Mbit SPI BIOS |
| Watchdog | Software Programmable Supports 1~255 sec. System Reset |
| TPM | TPM 2.0 |
| Display | |
|---|---|
| DisplayPort | 3x DisplayPort 1.4a, support resolution 4096 x 2304 (1x DP Port Co-layout HDMI Connector) |
| HDMI | Yes, Shared by 1x DP port |
| Multiple Display | Triple Display |
| Storage | |
|---|---|
| mSATA | 1x mSATA |
| SIM Socket | 2x External SIM socket (Mini PCIe attached) |
| SSD/HDD | 1x Internal 2.5" SATA HDD Bay (support H=9mm) 1x Removable 2.5" SATA HDD Bay (support H=7mm, hot-swappable) Support RAID 0, 1, 5 |
| Expansion | |
|---|---|
| M.2 | 1x M.2 (E Key, PCIe x1, USB 2.0, 2230), 1x M.2 B Key, 2242/3042/3052 (PCIex2, Support AI Module/NVMe Storage) (PCIex1&USB 3.2 Gen1, Support 4G/5G) |
| Mini PCIe | 1x Full-size Mini PCIe |
| Expansion Modules | Occupied One Universal I/O Slot: • 4-port GbE module with Intel® I350 Chipset, RJ-45 or M12 connector (PoE optional) • 2-Port 10GbE RJ45 with Intel X710 Chipset • 4-Port USB with Renesas uPD720201K8 host controller (share PCIe Gen2 x1 bandwidth) • 1x M.2 M-Key (PCIe x4 Lane, 2242/2260) for NVMe/AI Module • 2x M.2 B-Key 2242/3042/3052: - 2x M.2 (PCIe x2 Lane) for NVMe/AI Module - 1x M.2 (PCIe x2 Lane) for NVMe/AI Module and 1x M.2 (PCIe x1 Lane + USB 3.2 Gen 1) for 4G/5G Module, 1x External SIM socket (M.2 attached) |
| Operating System | |
|---|---|
| Windows | Windows 10/11 |
| Linux | Linux kernel |
| I/O | |
|---|---|
| Audio | 1x Line-out |
| CAN | 2x CAN 2.0 A/B 2-pin Internal header |
| COM | 3x RS-232/422/485 ; 2x RS-232/422/485 (internal) |
| DIO | 8 in / 8 out (Isolated) |
| LAN | 2x RJ45 |
| Universal I/O Bracket | 1x Universal I/O Bracket (By mini PCIe interface) |
| USB | 6x USB 3.2 Gen 2 (10Gbps) 1x USB 3.2 Gen 1 (5 Gbps, internal) 1x USB 2.0 (internal) |
| Others | 5x WiFi Antenna Holes 1x Power Switch, 1x AT/ATX Switch, 1x Remote Power On/Off 1x PC/Car Mode Switch, 1x Delay Time Switch 1x CMOS Battery 1x 4-Pin FAN Connector |
| Power | |
|---|---|
| Power Mode | AT, ATX |
| Power Supply Voltage | 9~48VDC |
| Power Ignition Sensing | Power Ignition Management |
| Power Connector | 3-pin Terminal Block |
| Power Adaptor | Optional AC/DC 24V/5A, 120W Optional AC/DC 24V/9.2A, 220W |
| Power Protection | OVP (Over Voltage Protection) OCP (Over Current Protection) Reserve Protection |
| Environment | |
|---|---|
| Operating Temp. | -25°C to 70°C (35W CPU) |
| Storage Temp. | -30°C to 85°C |
| Relative Humidity | 10% to 95% (non-condensing) |
| Vibration | IEC60068-2-64:2008 With HDD: 1 Grms (5 - 500 Hz, 0.5 hr/axis) With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis) Designed to comply with MIL-STD-810G Method 514.7 Procedure I |
| Shock | IEC60068-2-27:2008 With SSD: 50G half-sin 11ms Designed to comply with MIL-STD-810G Method 516.7 Procedure I |
| Standards / Certification | UL, CE, FCC Class A, EMC Conformity with EN50155 & EN50121-3-2 |
| Physical | |
|---|---|
| Construction | Extruded Aluminum with Heavy Duty Metal |
| Dimension | 192 (W) x 227 (D) x 60.3 (H) mm |
| Weight | 3.3kg - 4.1 kg |
| Mounting | Wall Mounting |

